Bond3D

During my internship at Bond3D I was tasked with designing a mechatronic solution including mechanical, sensor, control, and software design for a problem regarding development of a pressure-controlled 3D-printer using PEEK as printing material. This problem was broad with a lot of freedom to pursue different approaches to the problem. However, this of course comes with many responsibilities. For me, this freedom and responsibility was very important for my enthusiasm to tackle the problem head on. Many different people within the organization helped me to properly implement the design and everyone was almost always available for advice. At the end of my internship, I built a POP (proof-of-principle) setup to test the design and analysed the results to conclude on the performance of the design as well as the control system that was implemented. Overall, the assignment was very interesting about learning how to implement my mechatronic design knowledge into an actually functional system in a corporate environment and concluding on the performance by comparing with simulations.


Demcon High-Tech Systems
08Oct

Demcon High-Tech Systems

My internship was at Demcon High-Tech Systems in Enschede. The goal of the internship assignment was to assess whether a co-simulation...

Batenburg
08Oct

Batenburg

Batenburg Instalatietechniek is a division of the Company Batenburg that provides design, installation, and maintenance for technical...

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